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Chemistry between us

Sola Soldering Chemicals

Flux 18/09-S

Flux 18/09-S is VOC-free, rosin/resin-free no-clean flux. The organic activators used in the formulation provides excellent wetting and top-side hole fill, therefore the flux performs well, even when used on poorly preserved copper substrate. With the help of several additives, the surface tension between the solder mask and the solder is reduced, and thus the tendency for solderball generation is reduced significantly. By means of its thermally stable design, Flux 18/09-S also reduces the occurrence of solder bridging.

Flux 33/02

Flux 33/02 is a resin containing no-clean flux. By its use, the tendency for solder balling and solder bridging is significantly eliminated. 33/02 has a low tendency for solder ball generation over a wide variety of solder masks during wave soldering, or selective soldering operations. Flux 33/02 is a very good choice for board designs which are sensitive to solder bridging, or to solder ball frequency.

Flux 33/04

Flux 33/04 is a resin-containing flux designed to provide the attributes of excellent solderability even in high-density boards in both Lead-Free and eutectic tin/lead processes. It is designed to have low bridging as well as superior performance in hole fill and solderballing. Additionally, it provides good lead free solder joint cosmetics with an evenly spread residue.

Flux 33 ESG

Flux 33 ESG is an active low solids, no-clean flux and developed for the best board cosmetics. It functions well to eliminate the tendency for solder balling and solder bridging. It delivers outstanding performance with a wide thermal process window with both lead-free wave soldering processes, and also for tin-lead production lines.